Visual Inspection
To inspect the component in 360° all-demensional dirction with microscope, i.e. the package, IC type, date and lot number, printing and assembling status,
pin configuration, coplanarity and plating condition, etc. This is the first, and most essential, step for any component evaluation. We inspect the component
and the packaging to identify non-conformances that tell us the true condition of the parts. New, used, usable, remarked, coplanarity problems,
chips and cracks, improper packaging, potential solderability problems, etc. are all identified in the process.
De-cap Inspection
It is a destructive test that removes the insulation material of the component to reveal the die. The die is analyzed for inner markings (part number, manufacturer name or logo, lot numbers) and architecture to determine the authenticity of the device. As with X-ray analysis, use of a known-good part (golden sample) is beneficial in comparing to the unknown. This is an effective way to sort out fake components.
ROHS/rohs Test
Many customers require that their products should meet ROHS directive. No hazardous substances should be out of limits. They are Pb, Hg, Cd, Cr6+, PBB, PBDE.
By special rohs measurement instrument, the products can be detected if they meet ROHS directive. Official CBAS report can be provided for exporting electronic products.
Key Function Test
Key Functional Test is also known as Gross Functional Testing or main functional testing, is a dynamic testing method performed under specified conditions (usually normal working conditions & normal temperature) to simulate the real application circuit at end users side and carry out necessary logical & signal experiments while not considering the parameters limits (e.g: maximum or minimum value) on the original datasheet to test & verify whether the DUT(Device Under Test) can function normally .
Generally, Key Functional Test is a swift test method for gathering information and a relatively fast & low-cost consuming testing method which can meet the requirements of general application circuit of devices.
Full Function Test
Full function test and special characteristic tests are called for short as Full function test. According to original datasheet, application notes & end-users' application circuit, all the fucntions will be tested, i.e. DC characteristic test, programming test, etc.
